Customization: | Available |
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Production Scope: | Product Line |
Automation: | Automation |
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Double track online glue dispenser
Application industry products
3C consumer electronics.
Mobile phone shell assembly, touch screen module, LCD, lens module, microphone bonding, protective glue dispensing, etc.
Automotive Aerospace.
Aircraft cockpit, body painting, measuring instruments, sensors, instrument panel, transmission device, motor system, fuel system, RTV component reinforcement, FCU heat dissipation glue. Engine cylinder head and water tank sealing, bearing grease spot coating, sensor potting, PCB board coating, etc.
Panel light.
LCD, AMOLED, side reinforcement, water glue bonding, FPC reinforcement, three proofing paint, sealing dam, interface sealing, filling, etc.
semiconductor.
Dam enclosure process, solid point silver glue, led glue, underfill process, qlobtop packaging, cob packaging, etc.
microelectronics.
Point red glue, tin education, point three proofing glue, component pin packaging, etc.
Biotechnology.
Semiconductor catheter spraying, contact lenses, films, pacemakers, vacuum blood collection vessels, precise sampling and sub packaging of biological enzymes.
Applied product process:
Smt&pcb assembly - bottom filling point epoxy resin and liquid silicone.
Epoxy resin and red glue at the encapsulation point of components / pins.
Corner bonding point epoxy resin.
Heat conducting silicone grease and solder paste at chip heat dissipation point.
Glue dispensing for mobile phone assembly - glue dispensing for screen, UV glue for OLED screen and hot melt glue for LCD screen.
Glue dispensing for mobile phone assembly - glue dispensing for the middle frame, hot melt glue for the narrow frame of the middle frame of the curved surface.
Assembly dispensing type charging interface C-point epoxy resin, UV, waterproof silicone.
Automotive electronics -rtv components reinforcement point silicone, AB glue.
Automotive electronics ECU heat dissipation glue dispensing of automotive heating elements and heat dissipation modules.
Automobile electronics PCB board coating spraying three proofing paint.
Semiconductor - chip level bottom filling, global top (top sealing) point epoxy resin.
Semiconductor dome coating point epoxy resin, liquid silica gel (heat curing).
Semiconductor dam&fill cofferdam with low filling point & high epoxy resin.
Led micro LED point epoxy resin.
Led Mini LED (micron light emitting diode) point epoxy resin.
LED outdoor LED display screen with AB glue.
Bank security - camera sealing point epoxy resin, UV, hot melt adhesive.
Smart wear - AR glasses point epoxy resin, UV, hot melt adhesive, heat dissipation silicone grease.
Smart wear - headset / watch point epoxy, UV, hot melt adhesive, silicone.
Module -vcm (voice coil motor) point epoxy resin, UV, hot melt adhesive.
Module CCM (camera module) point epoxy resin, UV, hot melt adhesive.
Module - silicon microphone MEMS point UV, epoxy resin, solder paste.
Module - speaker point epoxy, UV, hot melt adhesive.
Module - side key point epoxy resin, UV glue.
Module - vibration motor point UV.
Product functions:
The integrated frame has stable structure and meets the accuracy requirements of high-speed operation.
Double track transmission to improve production efficiency.
Rich dispensing compatibility schemes (different dispensing valve bodies are replaced by different glues).
Glue path detection module (to detect and monitor the dispensing width, glue position offset, the size of the glue path and whether the glue path breaks).
Glue weighing module (imported Mettler brand, 0.1mg/ 10000 grams or 0.01mg/ 100000 grams, optional accurate weighing balance, to monitor the stability of glue quantity at any time).
Automatic needle alignment module (fully automatic needle XYZ calibration, reduce manual operation instability, and improve needle alignment accuracy and efficiency).
MES system (real-time online barcode scanning, automatic switching of processing documents, glue dispensing software connected to the production management MES system, and customized services can be achieved according to the requirements of customers' MES).